Interfacial Microstructure between Thick Aluminum Wire and Pad Formed by Ultrasonic Bonding

• KITAMORI S.

Journal

• 12^<th> Symposium on Microjoining and Assembly Technology in Electronics, 2006

  12^<th> Symposium on Microjoining and Assembly Technology in Electronics, 2006 345-348, 2006

Details

• CRID: 1574231875510711808
• NII Article ID: 10030150329
• Data Source:
  • CiNii Articles