Solid-State Low Temperature Bonding of Copper and Tin

• MAEDA M.

収録刊行物

• 16^<th> Symposium on Microjoining and Assembly Technology in Electronics, 2010

  16^<th> Symposium on Microjoining and Assembly Technology in Electronics, 2010 393-396, 2010

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• CRID: 1573950400533999744
• NII論文ID: 10030150334
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