ポリピロールナノ分散液を用いた樹脂上への無電解銅めっき Electroless Copper Plating on Resins Using Nano-Dispersion of Polypyrrole

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In electroless copper plating using a nanodispersion of polypyrrole, adhesion and the deposition mechanism were studied. Using this electroless plating method, copper plating with high adhesive ability was produced on resins while maintaining a smooth surface. Results of XPS and SEM measurements suggest that the palladium ions in catalyst solutions are reduced by electron-donating dedoped polypyrrole to give zero-valent palladium, which acts as a catalyst of electroless copper plating. The reduction effects of polypyrrole on the palladium ions operate in the direction of polypyrrole thickness. Consequently, not only the polypyrrole surface but also the polypyrrole inner layer can supply electrons for palladium ions. Regulation of the polypyrrole thickness is necessary to obtain plating with high adhesive ability. This method is applicable to various resins because high adhesion between the polypyrrole layer and resins can be accomplished by choosing suitable binders for respective resins. In addition, direct pattern plating is obtainable by the pattern printing of polypyrrole using this method because palladium catalysts are only adsorbed onto sites with polypyrrole. In summary, this method is expected to be effective as a technology for use in etching-free plating on resins.

収録刊行物

  • 表面技術 = The journal of the Surface Finishing Society of Japan

    表面技術 = The journal of the Surface Finishing Society of Japan 62(12), 691-695, 2011-12-01

    一般社団法人 表面技術協会

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各種コード

  • NII論文ID(NAID)
    10030476063
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    023358226
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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