フォトリソグラフィ-陽極酸化-化学エッチングによるアルミニウム圧延板の装飾的表面加工 Surface Patterning for Decorative Purposes of Aluminum Plate using Photolithography-Anodization-Chemical Etching Process

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Surface patterning is an important technology for improving product design. This paper describes the fabrication of three-dimensional microstructures on aluminum plates using photolithography, anodization, and chemical etching. Photoresist patterns were prepared on an aluminum plate using a standard photolithography technique. The aluminum plate was anodized in sulfuric acid at a controlled concentration and bath voltage. During anodization, an anodic oxide film was formed on the photoresist/aluminum plate interface and in an open region. The oxide film formation was sensitive to both sulfuric acid concentration and bath voltage. The aluminum plate was expanded by anodization. The volume expansion factor (calculated as the ratio of the oxide film thickness to the thickness of the consumed aluminum) was 1.44-1.69.<br>The oxide film was removed by chemical etching in phosphoric acid. Thereby, the aluminum surface was exposed, and convex shapes were formed. The surface roughness of the plate after chemical etching was comparable to its value before fabrication. The mean roughness Ra was <20 nm. Quadrangular pyramids, cones, and hexagonal pyramids were fabricated successfully on the aluminum plate by changing the photoresist mask pattern. Anodization and chemical etching conditions were controlled for accurate shape control of the three-dimensional metallic microstructures.

収録刊行物

  • 表面技術 = The journal of the Surface Finishing Society of Japan

    表面技術 = The journal of the Surface Finishing Society of Japan 63(1), 47-52, 2012-01-01

    一般社団法人 表面技術協会

参考文献:  19件中 1-19件 を表示

  • <no title>

    YAMAGUCHI H.

    J. JILM 59, 204, 2008

    被引用文献1件

  • <no title>

    NOSE M.

    J. Japan Inst. Metals 62, 887, 1998

    被引用文献1件

  • <no title>

    ISOYAMA E.

    J. JILM 40, 460, 1990

    被引用文献1件

  • <no title>

    KATSUMATA N.

    J. Surf. Finish. Soc. Jpn. 59, 333, 2008

    被引用文献1件

  • <no title>

    LANGA S.

    Electrochemical and Solid-State Letters 8, C30, 2005

    被引用文献1件

  • <no title>

    BARELA M. J.

    Electrochem. Solid-State Lett. 8, C4, 2005

    被引用文献1件

  • <no title>

    COSSE J. T.

    J. Micromech. Microeng 17, 89, 2007

    被引用文献1件

  • <no title>

    ZHAO X.

    J. Electrochem. Soc. 152, B411, 2005

    被引用文献1件

  • <no title>

    BREVNOV D. A.

    Electrochem. Solid-State Lett. 9, B35, 2006

    被引用文献1件

  • <no title>

    河合慧

    Alの機能的アノード処理 18, 2005

    被引用文献1件

  • <no title>

    ASAHINA T.

    J. JILM 58, 375, 2008

    被引用文献1件

  • <no title>

    VRUBLEVSKY I.

    Appl. Surf. Sci. 222, P215, 2004

    被引用文献1件

  • <no title>

    ARURAULT L.

    Transactions of the Institute of Metal Finishing 86, 51, 2008

    被引用文献1件

  • <no title>

    ZHOU F.

    J. Electrochem. Soc. 158, C202, 2011

    被引用文献1件

  • <no title>

    OKAMURA Y.

    Kinzoku Hyomen Gijutsu 22, 186, 1971

    被引用文献1件

  • <no title>

    KIKUCHI T.

    Electrochimica Acta 54, 7018, 2009

    被引用文献1件

  • <no title>

    日本化学会編

    化学便覧 509, 1966

    被引用文献1件

  • <no title>

    KATSUMATA N.

    Yamanashi Prefectural Industrial Technology Center Report 22, 44, 2008

    被引用文献1件

  • <no title>

    日本アルミニウム協会標準化総合委員会

    アルミニウムハンドブック 166, 2001

    被引用文献1件

各種コード

  • NII論文ID(NAID)
    10030476352
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    023459232
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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