硫酸銅電気めっき液中の-価銅の分析 Analysis of Cu(I) in Copper Sulfate Electroplating Solution

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著者

    • 野間 弘昭 NOMA Hiroaki
    • (独)産業技術総合研究所 生産計測技術研究センター Measurement Solution Research Center, National Institute of Advanced Industrial Science and Technology (AIST)
    • 古賀 淑哲 KOGA Toshiaki
    • (独)産業技術総合研究所 生産計測技術研究センター Measurement Solution Research Center, National Institute of Advanced Industrial Science and Technology (AIST)
    • 平川 智恵子 [他] HIRAKAWA Chieko
    • (独)産業技術総合研究所 生産計測技術研究センター Measurement Solution Research Center, National Institute of Advanced Industrial Science and Technology (AIST)
    • 野中 一洋 NONAKA Kazuhiro
    • (独)産業技術総合研究所 生産計測技術研究センター Measurement Solution Research Center, National Institute of Advanced Industrial Science and Technology (AIST)
    • 貝吹 忠拓 KAIBUKI Tadahiro
    • 住友電工プリントサーキット(株)生産技術部 Design & Production Engineering Department, Sumitomo Electric Printed Circuits, Inc.
    • 森山 周作 MORIYAMA Syusaku
    • 住友電工プリントサーキット(株)生産技術部 Design & Production Engineering Department, Sumitomo Electric Printed Circuits, Inc.

抄録

Analysis of Cu(I) in copper sulfate electroplating solution was conducted by absorption of a chelate of Cu(I) with bathocuproinedisulfonic acid, disodium salt (BCS). Although the absorption of new copper sulfate electroplating solutions was negligible, the absorption of operating solutions was clear. The difference of new solutions and operating solutions was also verified using an electrochemical method for detection of Cu(I). We concluded that the Cu(I) ions are measurable using this chelate reagent. The absorption increased quickly in a few minutes after mixing with the chelate reagent and subsequently continued to increase slowly. To clarify this phenomenon, the organic compounds in the plating solutions were analyzed and Cu(I)-PEG (polyethylene glycol) complexes with different chain lengths were detected using MALDI-MS. Results show that Cu(I) ions exist in the plating solutions not only as small complexes with small organic compounds but also as large complexes with PEG. Small complexes of Cu(I) can react quickly with BCS and cause the rapid increase of the absorption in a few minutes after mixing. Cu(I)-PEG complexes prevent the chelating reaction of Cu(I) with BCS by steric hindrance of PEG, which explains the subsequent slow increase of the absorption. Using this chelate method, we monitored quantities of Cu(I) in copper sulfate electroplating production lines, detected the variation of Cu(I) quantities, and found the increase during the resting state of the lines.

収録刊行物

  • 表面技術 = The journal of the Surface Finishing Society of Japan

    表面技術 = The journal of the Surface Finishing Society of Japan 63(2), 124-128, 2012-02-01

    一般社団法人 表面技術協会

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各種コード

  • NII論文ID(NAID)
    10030476670
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    023510147
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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