Correlation between Mechanical and Dielectric Relaxation Processes in Epoxy Resin Composites with Nano- and Micro-fillers

• Hyuga Mayumi

  Department of Electrical Engineering and Bioscience, Waseda University

• Tanaka Toshikatsu

  Graduate School of Information, Production, and Systems, Waseda University

• Ohki Yoshimichi

  Department of Electrical Engineering and Bioscience, Waseda University

• Imai Takahiro

  Power and Industrial Systems R&D Center, Toshiba Corporation

• Harada Miyuki

  Department of Applied Chemistry, Kansai University

• Ochi Mitsukazu

  Department of Applied Chemistry, Kansai University

Bibliographic Information

Other Title

• ナノおよびマイクロフィラーが添加されたエポキシ樹脂コンポジットにおける力学緩和と誘電緩和の相関
• ナノ オヨビ マイクロフィラー ガ テンカ サレタ エポキシ ジュシ コンポジット ニ オケル リキガク カンワ ト ユウデン カンワ ノ ソウカン

Abstract

Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T_g) decreases when a small content of nanoclay modified by octadecylamine was added, while the decrease in T_g is suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T_g increases when microsilica was added abundantly. At temperatures above T_g, both mechanical and dielectric relaxations are accelerated in samples with octadecylamine-modified nanoclay, while the acceleration does not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations are restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T_g and low dielectric loss.

Journal

• IEEJ Transactions on Fundamentals and Materials

  IEEJ Transactions on Fundamentals and Materials 131 (12), 1041-1047, 2011

  The Institute of Electrical Engineers of Japan

Keywords

• polymer nanocomposite
• microcomposite
• epoxy resin
• mechanical properties
• dielectric properties
• filler modifier

Details

• CRID: 1390001204599365632
• NII Article ID: 10030523542
• NII Book ID: AN10136312
• DOI: 10.1541/ieejfms.131.1041
• ISSN: 13475533
• ISSN: 03854205
• NDL BIB ID: 023349435
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I023349435
• Web Site: https://www.jstage.jst.go.jp/article/ieejfms/131/12/131_12_1041/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed