微小切削装置を用いた薄膜の剥離挙動観察と密着性評価

• 豊川 良平

  （株）コベルコ科研 エレクトロニクス事業部

• 高見 和宏

  （株）コベルコ科研 エレクトロニクス事業部

• 加藤 隆明

  （株）コベルコ科研 エレクトロニクス事業部

• 伊藤 弘高

  （株）神戸製鋼所 技術開発本部 材料研究所

• 佐藤 俊樹

  （株）神戸製鋼所 技術開発本部 材料研究所

書誌事項

タイトル別名

• The Behavior of Thin Film Delamination during Cutting by Using Micro Cutting Method
• ビショウ セッサク ソウチ オ モチイタ ハクマク ノ ハクリ キョドウ カンサツ ト ミッチャクセイ ヒョウカ

抄録

    Some metal thin films, for example, an Al thin film of about 1 to 2 μm thickness, are delaminated with bending like a polygonal shape during micro cutting. Several samples of Al thin film on Si wafer and some glasses were prepared and the relation between horizontal force and delamination phenomenon during micro cutting was studied. In addition, the possibility to develop quantitative adhesion test by using micro cutting method was considered. As a result, films were delaminated when the horizontal force reached at the critical force and the approximate delamination area was able to be calculated from the relation between horizontal force and delamination phenomenon. But to establish quantitative adhesion test by using micro cutting method, developing the method of evaluating the energy used only for delamination in the total energy provided by cutting blade is needed. Furthermore, to validate the evaluated energy by comparing with the one from other adhesion test, techniques of making samples those are used correctly in different adhesion tests are important.

収録刊行物

• 実験力学

  実験力学 12 (1), 19-25, 2012

  日本実験力学会

キーワード

• Adhesion Property
• Thin Film
• Evaluation Method
• Micro Cutting
• Four-point Bending Test

詳細情報

• CRID: 1390001205189678976
• NII論文ID: 10030556070
• NII書誌ID: AA11822914
• DOI: 10.11395/jjsem.12.19
• ISSN: 18844219
• ISSN: 13464930
• NDL書誌ID: 023662321
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I023662321
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可