鉛フリーハンダをダイヤモンド砥粒固定材に用いたソーワイヤの開発とそれを用いたサファイヤインゴットのスライス加工への適用 Development of Diamond Saw Wire using Pb-free Solder as Fixing Material and Its Application to Slicing of Sapphire Ingot

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We produced the diamond saw wire using the commercial lead-free solder as a fixing material of diamond abrasive particles, and sliced sapphire ingots into wafers with the saw wires.<BR>The co-drawn brass coated piano wire was adopted as a core material. Electroless Ni-P coated diamond abrasive particles were employed to enhance adhesion between the solder and diamond abrasive particle. We developed the equipment that performs solder coating on wire, temporary fitting of diamond abrasive particles on wire, and final fixing, in one continuous operation. We were able to produce saw wires as long as around 2 km. By using these saw wires we succeeded in slicing a sapphire ingot of 50.8 mm diameter into 50 wafers at a time. However, the average thickness of the wafers tended to be thinner toward the winding side of the wire saw machine. The total thickness variation (TTV), the maximum surface waviness (WT) and the maximum surface roughness (RZ) tended to increase toward the winding side. During the slicing process of ingot, the load on the saw wire maximized when the wire had moved a considerable distance away from the center of the ingot.

We produced the diamond saw wire using the commercial lead-free solder as a fixing material of diamond abrasive particles, and sliced sapphire ingots into wafers with the saw wires.<BR>The co-drawn brass coated piano wire was adopted as a core material. Electroless Ni-P coated diamond abrasive particles were employed to enhance adhesion between the solder and diamond abrasive particle. We developed the equipment that performs solder coating on wire, temporary fitting of diamond abrasive particles on wire, and final fixing, in one continuous operation. We were able to produce saw wires as long as around 2 km. By using these saw wires we succeeded in slicing a sapphire ingot of 50.8 mm diameter into 50 wafers at a time. However, the average thickness of the wafers tended to be thinner toward the winding side of the wire saw machine. The total thickness variation (TTV), the maximum surface waviness (WT) and the maximum surface roughness (RZ) tended to increase toward the winding side. During the slicing process of ingot, the load on the saw wire maximized when the wire had moved a considerable distance away from the center of the ingot.

収録刊行物

  • 粉体および粉末冶金

    粉体および粉末冶金 59(5), 227-232, 2012-05-15

    一般社団法人 粉体粉末冶金協会

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各種コード

  • NII論文ID(NAID)
    10030765058
  • NII書誌ID(NCID)
    AN00222724
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    05328799
  • NDL 記事登録ID
    023804693
  • NDL 請求記号
    Z17-274
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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