Clarification of Deposition Mechanism of Copper Particle in Cold Spray Process

DOI 26 References

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Other Title
  • コールドスプレー法における銅粒子堆積機構の解明

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Abstract

Application of cold spray process is expected in the various industrial fields such as automobile, aircraft and electronics. So many investigations for practical application have been actively performed in many research organizations. However, as the process has just started in these days, fundamental aspect like deposition mechanism itself has not been well understood up to today. To establish the higher reliability or controllability of the cold spray process, fundamental research, especially on the deposition mechanism, may become a key for the process development. We tried the clarification of particle deposition mechanism in cold spray process by experimental approach. In this study, deposition behavior of sprayed individual particle onto substrate surface was investigated precisely.<br>Self designed cold spray equipment was installed in the laboratory and deposition behavior of sprayed individual metallic particles on the substrate surface was fundamentally investigated. As a preliminary experiment, pure Cu particles were sprayed on mirror polished stainless steel substrate surface. Particles diameter, process gas, gas pressure, gas temperature and substrate temperature were systematically changed as the process parameters, and effect of these parameters on the flattening or deposition behavior of an individual particle was investigated.

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Details 詳細情報について

  • CRID
    1390001204727312256
  • NII Article ID
    10030885089
  • NII Book ID
    AN1005067X
  • DOI
    10.2207/qjjws.25.537
  • COI
    1:CAS:528:DC%2BD1cXkvVGisbs%3D
  • ISSN
    24348252
    02884771
  • Text Lang
    ja
  • Data Source
    • JaLC
    • Crossref
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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