Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices

• SHIN Sang-Baie

  Dept. of Electronic and Information Engineering, Toyohashi Univ. of Technology

• IIJIMA Ko-Ichiro

  Dept. of Electronic and Information Engineering, Toyohashi Univ. of Technology

• OKADA Hiroshi

  Electronics-Inspired Interdisciplinary Research Institute, Toyohashi Univ. of Technology

• IWAYAMA Sho

  Stanley Electric Co., Ltd.

• WAKAHARA Akihiro

  Dept. of Electronic and Information Engineering, Toyohashi Univ. of Technology

Abstract

In this paper, we designed and fabricated large scale micro-light-emitting-diode (LED) arrays and silicon driver for single chip device for realizing as prototypes of heterogeneous optoelectronic integrated circuits (OEICs). The large scale micro-LED arrays were separated by a dry etching method from mesa structure to 16,384 pixels of 128 × 128, each with a size of 15µm in radius. Silicon driver was designed the additional bonding pad on each driving transistor for bonding with micro-LED arrays. Fabricated micro-LED arrays and driver were flip-chip bonded using anisotropic conductive adhesive.

Journal

• IEICE Transactions on Electronics

  IEICE Transactions on Electronics E95.C (5), 898-903, 2012

  The Institute of Electronics, Information and Communication Engineers

Keywords

• opto-electronic integrated circuit
• micro-LED
• flip-chip bonding
• GaN LED arrays

Details

• CRID: 1390282679354510720
• NII Article ID: 10030941533
• NII Article ID: 130002135540
• NII Book ID: AA10826283
• DOI: 10.1587/transele.e95.c.898
• BIBCODE: 2012IEITE..95..898S
• ISSN: 17451353
• ISSN: 09168524
• Web Site: https://www.jstage.jst.go.jp/article/transele/E95.C/5/E95.C_5_898/_pdf
• Text Lang: en
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed