Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices
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- SHIN Sang-Baie
- Dept. of Electronic and Information Engineering, Toyohashi Univ. of Technology
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- IIJIMA Ko-Ichiro
- Dept. of Electronic and Information Engineering, Toyohashi Univ. of Technology
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- OKADA Hiroshi
- Electronics-Inspired Interdisciplinary Research Institute, Toyohashi Univ. of Technology
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- IWAYAMA Sho
- Stanley Electric Co., Ltd.
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- WAKAHARA Akihiro
- Dept. of Electronic and Information Engineering, Toyohashi Univ. of Technology
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Abstract
In this paper, we designed and fabricated large scale micro-light-emitting-diode (LED) arrays and silicon driver for single chip device for realizing as prototypes of heterogeneous optoelectronic integrated circuits (OEICs). The large scale micro-LED arrays were separated by a dry etching method from mesa structure to 16,384 pixels of 128 × 128, each with a size of 15µm in radius. Silicon driver was designed the additional bonding pad on each driving transistor for bonding with micro-LED arrays. Fabricated micro-LED arrays and driver were flip-chip bonded using anisotropic conductive adhesive.
Journal
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- IEICE Transactions on Electronics
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IEICE Transactions on Electronics E95.C (5), 898-903, 2012
The Institute of Electronics, Information and Communication Engineers
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Details 詳細情報について
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- CRID
- 1390282679354510720
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- NII Article ID
- 10030941533
- 130002135540
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- NII Book ID
- AA10826283
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- BIBCODE
- 2012IEITE..95..898S
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- ISSN
- 17451353
- 09168524
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- Text Lang
- en
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed