High-speed processing of diamond wire tool by turn drum plating apparatus

• SUWABE Hitoshi

  Kanazawa Institute of Technology

• AKI Mitsuru

  Graduate School of Kanazawa Institute of Technology

• Ishikawa Ken-ichi

  Kanazawa Institute of Technology

Bibliographic Information

Other Title

• 回転ドラム式メッキ装置によるダイヤモンドワイヤ工具の高速作製法の開発に関する研究
• カイテン ドラムシキ メッキ ソウチ ニ ヨル ダイヤモンドワイヤ コウグ ノ コウソク サクセイホウ ノ カイハツ ニ カンスル ケンキュウ

Abstract

An electrodeposited diamond wire tool is utilized for wafer-slicing of silicon, which is used as the baseplate of crystal-type solar cells. High-speed manufacture is one of the most important factors for manufacture of these diamond wire tools at low cost. In this study, a drum-type plating apparatus was developed that can plate diamond grains by electrodeposition on piano wire at high speed by controlling the relative speed between the piano wire and the diamond grains. A prototype of the diamond wire tool was manufactured using piano wire of φ120μm, and its plating and slicing abilities were evaluated. The results indicated the usefulness of the developed plating system to manufacture the diamond wire tool.

Journal

• Journal of the Japan Society for Abrasive Technology

  Journal of the Japan Society for Abrasive Technology 56 (10), 703-708, 2012

  The Japan Society for Abrasive Technology

Keywords

• grinding
• slicing
• diamond grains
• wire tool
• plating

Details

• CRID: 1390282679310020096
• NII Article ID: 10031120197
• NII Book ID: AN10192823
• DOI: 10.11420/jsat.56.703
• ISSN: 18807534
• ISSN: 09142703
• NDL BIB ID: 024019278
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I024019278
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed