EBSD Analysis of Microstructures Along the Depth Direction in Very Narrow Cu Wires

• KE Yiqing

  Graduate School of Science and Engineering, Ibaraki University

• NAMEKAWA Takashi

  Department of Materials Science and Engineering, Ibaraki University

• TAMAHASHI Kunihiro

  Department of Materials Science and Engineering, Ibaraki University

• INAMI Takashi

  Department of Materials Science and Engineering, Ibaraki University

• ONUKI Jin

  Department of Materials Science and Engineering, Ibaraki University

Abstract

A microstructure analysis along the trench depth direction of Cu wires as a function of the purity of plating materials was carried out using electron backscattering diffraction (EBSD) analysis combined with advanced CMP technique. The Cu wire plated with high purity plating materials (6N-electrolyte and 8N-anode) was found to have 13% larger grains and 50% lower ratio of small grains (less than 45 nm) than those for the Cu wire plated with conventional purity plating materials (3N-electrolyte and 3N-anode) at the bottom region of the trench after annealing. A grain growth model in the trench depth direction was also investigated.

Journal

• Electrochemistry

  Electrochemistry 81 (4), 246-250, 2013

  The Electrochemical Society of Japan

Keywords

• Cu Wires
• EBSD
• Microstructure
• Depth Direction

Details

• CRID: 1390001206497586944
• NII Article ID: 10031139478
• NII Book ID: AN00151637
• DOI: 10.5796/electrochemistry.81.246
• ISSN: 21862451
• ISSN: 13443542
• NDL BIB ID: 024383611
• Web Site: http://id.ndl.go.jp/bib/024383611
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I024383611
• Web Site: https://www.jstage.jst.go.jp/article/electrochemistry/81/4/81_12-10-E2595/_pdf
• Text Lang: en
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Allowed