無電解Ni-Bめっきの初期析出におよぼす浴中化学種の影響

• 永井 太一

  長岡技術科学大学 大学院工学研究科

• 程内 和範

  長岡技術科学大学 技術支援センター

• 西山 洋

  長岡技術科学大学 物質・材料系

• 松原 浩

  長岡技術科学大学 物質・材料系

書誌事項

タイトル別名

• The Effect of Chemical Species in the Bath on the Initial Deposition of Electroless Ni-B Plating
• ムデンカイ Ni-Bメッキ ノ ショキ セキシュツ ニ オヨボス ヨク チュウ カガクシュ ノ エイキョウ

抄録

Important factors for fabricating thinner and more uniform films by electroless Ni-B plating using dimethylamine borane (DMAB) as the reducing agent were discussed. The number density of initial deposits was pointed out as the important factor for fabrication of thinner and more uniform films. Transmission electron microscope observations were performed for initial deposits plated from baths of different pH. The number density was lower in deposits plated from pH 9-10 than in those plated from pH 6-8. Dimethylamine produced through an oxidation reaction of a reducing agent (DMAB) prevents the initial deposition. Such a lower number density appeared in pH 9-10.<br>Nickel citrate - ammonia complex was formed under ammoniacal conditions. The nickel citrate - ammonia complex contributed to the increase in the number density of grains. It was possible to eliminate deposition prevention through the appropriate selection of nickel complexes. Results show that the initial deposition with higher number density of grains was achieved at all pH of Ni-B plating baths.

収録刊行物

• 表面技術

  表面技術 64 (4), 248-252, 2013

  一般社団法人 表面技術協会

キーワード

• Electroless Ni-B Plating
• DMAB
• Initial Deposition

詳細情報

• CRID: 1390001204118047488
• NII論文ID: 10031165833
• NII書誌ID: AN1005202X
• DOI: 10.4139/sfj.64.248
• COI: 1:CAS:528:DC%2BC3sXhtVegsb7L
• ISSN: 18843409
• ISSN: 09151869
• NDL書誌ID: 024626944
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I024626944
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可