Bondability of Copper Joints Formed Using a Mixed Paste of Ag₂O and CuO for Low-Temperature Sinter Bonding

• Ogura Tomo

  Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

• Yagishita Tomohiro

  Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

• Takata Shinya

  Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

• Fujimoto Tomoyuki

  Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

• Hirose Akio

  Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

Bibliographic Information

Other Title

• Bondability of Copper Joints Formed Using a Mixed Paste of Ag₂O and CuO for Low-Temperature Sinter Bonding

Abstract

The bondability of copper joints formed using a mixed paste of silver oxide (Ag₂O) and copper oxide (CuO) that contained reducing solvents was evaluated in order to achieve bonds that exhibited high migration tolerance and could serve as Pb-free alternatives to the conventional bonds formed using high-melting point solders in electronics packaging. The Ag₂O particles reduced into silver nanoparticles at 150°C, whereas the CuO reduced into copper nanoparticles about 300°C. The joints formed using the Ag₂O/CuO mixed paste, when heated to the appropriate levels, exhibited bondability superior to that of conventional Pb–5Sn joints. The oxide film formed on the copper substrate was reduced by the combustion of polyethylene glycol 400, and bonding was achieved between the sintered layer and the copper substrate. A longer period resulted in the oxidisation of a few layers of sintered copper layers into Cu₂O. The ion-migration tolerance of the Ag₂O/CuO mixed paste was approximately four times that of a layer of pure sintered silver.

Journal

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 54 (6), 860-865, 2013

  The Japan Institute of Metals and Materials

Keywords

• silver oxide
• copper oxide
• ion migration
• sintering
• nanoparticles
• copper joint

Details

• CRID: 1390282679228548480
• NII Article ID: 10031176398
• NII Book ID: AA1151294X
• DOI: 10.2320/matertrans.md201202
• COI: 1:CAS:528:DC%2BC3sXht1Wgu7%2FL
• ISSN: 13475320
• ISSN: 13459678
• NDL BIB ID: 024524564
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I024524564
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/54/6/54_MD201202/_pdf
• Text Lang: en
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed