The Influence of Incorporated Additives in Lead-Free Electroless Nickel Plating Film on the Reliability of Solder Joint

• Tsuchida Tetsuyuki

  Technical Research Institute, TOPPAN PRINTING CO., LTD.

• Okubo Toshikazu

  Technical Research Institute, TOPPAN PRINTING CO., LTD.

• Kano Takahiro

  Graduate School of Engineering, Gunma University

• Shohji Ikuo

  Division of Mechanical Science and Technology, Faculty of Science and Technology, Gunma University

Bibliographic Information

Other Title

• 鉛フリー無電解Niめっき皮膜中の共析物がはんだ実装信頼性に及ぼす影響
• ナマリ フリー ムデンカイ Niメッキ ヒマク チュウ ノ キョウセキブツ ガ ハンダジッソウ シンライセイ ニ オヨボス エイキョウ

Abstract

Electroless Ni/Au or electroless Ni/Pd/Au plating is widely used as surface finishing for electronics assembly. Conventional electroless Ni plating films contain small amounts of lead derived from additives in their plating baths. However, it is expected that lead-free electroless nickel plating will be required if stricter environmental regulations are in force. In this study, the reliability of solder joints with lead-free electroless Ni/Au and Ni/Pd/Au plating was investigated. It was found that certain factors, such as Ni corrosion pitting and the behavior of the IMC (thickness, ratio of components and shape), affect the reliability of the lead-free solder joint in complex ways. Moreover, it was confirmed that these factors vary with the amount of additives (bismuth and sulfur) incorporated into these lead-free plating films.

Journal

• Journal of The Japan Institute of Electronics Packaging

  Journal of The Japan Institute of Electronics Packaging 16 (6), 484-491, 2013

  The Japan Institute of Electronics Packaging

Keywords

• Lead-free Electroless Ni/Pd/Au
• Lead-free Solder Joint
• Nickel Plating Additives

Details

• CRID: 1390001204560424832
• NII Article ID: 10031186257
• NII Book ID: AA11231565
• DOI: 10.5104/jiep.16.484
• COI: 1:CAS:528:DC%2BC3sXhslGisr7K
• ISSN: 1884121X
• ISSN: 13439677
• NDL BIB ID: 024876486
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I024876486
• Web Site: https://www.jstage.jst.go.jp/article/jiep/16/6/16_484/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed