実装基板における外観検査の動向  [in Japanese] Trends of Optical Inspection for PWBA  [in Japanese]

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Author(s)

Journal

  • Journal of The Japan Institute of Electronics Packaging

    Journal of The Japan Institute of Electronics Packaging 16(7), 504-507, 2013-11-01

    The Japan Institute of Electronics Packaging

References:  2

Codes

  • NII Article ID (NAID)
    10031196990
  • NII NACSIS-CAT ID (NCID)
    AA11231565
  • Text Lang
    JPN
  • Article Type
    REV
  • ISSN
    13439677
  • NDL Article ID
    024983917
  • NDL Call No.
    Z74-B258
  • Data Source
    CJP  NDL  J-STAGE 
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