積層型電子セラミックス素子の残留熱応力の解析  [in Japanese] Analysis of Residual Thermal Stresses in Multi-Layered Electronic Ceramic Devices  [in Japanese]

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Author(s)

Abstract

Commercially available multi-layered electronic devices such as tip condensers, cermic actuators or tip inductors are prepared by sintering mutually sandwiched layers of ceramics and metallic thin film electrodes. Accordingly, thermal expansion mismatch stresses occur in them owing to difference in thermal expansion coefficient between ceramic and metal layers. These stresses may result in crack or fracture formation in their ceramic layers or decrease in their capacitances or inductances. This paper discusses analytical treatment of these stresses on the basis of theoretical results for residual thermal stresses in a ceramic-to-metal joint described elsewhere.

Journal

  • Memoirs of Shonan Institute of Technology

    Memoirs of Shonan Institute of Technology 27(1), p75-78, 1993-03

    Shonan Institute of Technology

Codes

  • NII Article ID (NAID)
    110000480009
  • NII NACSIS-CAT ID (NCID)
    AN10400308
  • Text Lang
    JPN
  • Journal Type
    大学紀要
  • ISSN
    09192549
  • NDL Article ID
    3852176
  • NDL Source Classification
    PA45;ND21
  • NDL Source Classification
    ZM2(科学技術--科学技術一般--大学・研究所・学会紀要)
  • NDL Call No.
    Z14-320
  • Data Source
    NDL  NII-ELS 
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