積層型電子セラミックス素子の残留熱応力の解析

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  • Analysis of Residual Thermal Stresses in Multi-Layered Electronic Ceramic Devices
  • セキソウガタ デンシ セラミックス ソシ ノ ザンリュウ ネツ オウリョク ノ

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Commercially available multi-layered electronic devices such as tip condensers, cermic actuators or tip inductors are prepared by sintering mutually sandwiched layers of ceramics and metallic thin film electrodes. Accordingly, thermal expansion mismatch stresses occur in them owing to difference in thermal expansion coefficient between ceramic and metal layers. These stresses may result in crack or fracture formation in their ceramic layers or decrease in their capacitances or inductances. This paper discusses analytical treatment of these stresses on the basis of theoretical results for residual thermal stresses in a ceramic-to-metal joint described elsewhere.

Commercially available multi-layered electronic devices such as tip condensers, cermic actuators or tip inductors are prepared by sintering mutually sandwiched layers of ceramics and metallic thin film electrodes. Accordingly, thermal expansion mismatch stresses occur in them owing to difference in thermal expansion coefficient between ceramic and metal layers. These stresses may result in crack or fracture formation in their ceramic layers or decrease in their capacitances or inductances. This paper discusses analytical treatment of these stresses on the basis of theoretical results for residual thermal stresses in a ceramic-to-metal joint described elsewhere.

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