超音波接合におけるAl細線の変形特性と接合過程

• 柏原 稔

  正会員 日本電信電話公社電気通信研究所

• 服部 誠示

  正会員 日本電信電話公社電気通信研究所

書誌事項

タイトル別名

• Deformation Characteristics and Bonding Process of Al Fine Wire in Ultrasonic Bonding
• チョウオンパ セツゴウ ニ オケル Alサイセン ノ ヘンケイ トクセイ ト セツゴウ カテイ

抄録

For establishing the bonding technology in the interconnections of semiconductor devices, the ultrasonic bonding mechanism is pursued from the viewpoints of plastic deformation on Al fine wires and the states of peeled surfaces after bonding with their relations to bonding strength, when bonding to Al-evaporated films and Au-plated surfaces. The results are as follows : (1) Plastic deformation of the wire is influenced by the material properties, the film thickness and the microscopic irregularities of the surfaces being bonded. (2) Its deformation characteristics are classified into slipping on bonded surfaces, adhesion and restriction on their interface and slipping of a tool tip on the bonded surface. The extent in deformation is different in each stages. (3) Bonding strangth is dependent on the adhesion between the metals on the interface, which is affected by the microscopic irregularities on the bonded surfaces as well as by the bonding factors. (4) Plastic deformation of the wire correlates with the behaviors of restriction on the bonded surfaces in the course of bonding. (5) The true metallic contact on the interface formed by plastic flow and the temperature rise due to friction contribute to the progress in the bonding process, while the metal diffusion makes the bonding accomplish.

収録刊行物

• 精密機械

  精密機械 36 (425), 388-393, 1970

  公益社団法人 精密工学会

詳細情報

• CRID: 1390001204732103808
• NII論文ID: 130003960567
• NII論文ID: 110001289069
• NII書誌ID: AN00130014
• DOI: 10.2493/jjspe1933.36.388
• NDL書誌ID: 8275391
• ISSN: 03743543
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I8275391
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可