X線エネルギサブトラクションによるCSP実装基板のはんだ成分抽出 [in Japanese] Extraction of Solder Constituent from CSP Boards by Means of X-ray Energy Subtraction Mehod [in Japanese]
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With the high requirement of high-density packaging, CSP have been spread widely. To inspect the solder joint in CSP, an X-ray image has been used. However, an X-ray image contains not only solder joint but also capper leads. Therefore, it is very difficult to analyze the solder with robustness. In this paper, we propose a new method for extracting the solder constituent by means of Energy Subtraction. In the experience, we compared the performance of thick measurement between regular X-ray Image and Subtraction image. The result shows the advantageous performance of Subtraction method over regular one.
- Journal of Japan Institute of Electronics Packaging
Journal of Japan Institute of Electronics Packaging 4(1), 68-71, 2001-01-01
Japan Institute of Electronics Packaging