X線エネルギサブトラクションによるCSP実装基板のはんだ成分抽出  [in Japanese] Extraction of Solder Constituent from CSP Boards by Means of X-ray Energy Subtraction Mehod  [in Japanese]

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Author(s)

    • 寺本 篤司 TERAMOTO Atsushi
    • 名古屋電機工業株式会社オプトエレクトロニクス事業部 Opt-Electronics Div., Nagoya Electric Works Co., Ltd.
    • 堀場 勇夫 HORIBA Isao
    • 愛知県立大学情報科学部 Faculty of Information Science and Technology, Aichi Prefectural University

Abstract

With the high requirement of high-density packaging, CSP have been spread widely. To inspect the solder joint in CSP, an X-ray image has been used. However, an X-ray image contains not only solder joint but also capper leads. Therefore, it is very difficult to analyze the solder with robustness. In this paper, we propose a new method for extracting the solder constituent by means of Energy Subtraction. In the experience, we compared the performance of thick measurement between regular X-ray Image and Subtraction image. The result shows the advantageous performance of Subtraction method over regular one.

Journal

  • Journal of Japan Institute of Electronics Packaging

    Journal of Japan Institute of Electronics Packaging 4(1), 68-71, 2001-01-01

    Japan Institute of Electronics Packaging

References:  8

Cited by:  3

Codes

  • NII Article ID (NAID)
    110001716433
  • NII NACSIS-CAT ID (NCID)
    AA11231565
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    13439677
  • NDL Article ID
    5630898
  • NDL Source Classification
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL Call No.
    Z74-B258
  • Data Source
    CJP  CJPref  NDL  NII-ELS 
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