Direct Metallization of Copper Using Surface Modification and Thermocompression of Polyimide Resin.

• IKEDA Shingo

  Graduate School of Science, Konan University

• AKAMATSU Kensuke

  Faculty of Science and Engineering, High Tech. Research Center, Konan University

• NAWAFUNE Hidemi

  Graduate School of Science, Konan University

• MIZUMOTO Shozo

  Graduate School of Science, Konan University

• SEITA Masaru

  LeaRonal Japan Inc.

Bibliographic Information

Other Title

• ポリイミド樹脂の表面改質および熱圧着を利用する銅のＤｉｒｅｃｔ　Ｍｅｔａｌｌｉｚａｔｉｏｎ
• ポリイミド ジュシ ノ ヒョウメン カイシツ オヨビ ネツ アッチャク オ リヨウ スル ドウ ノ Direct Metallization

Abstract

A novel method is presented for the direct metallization of copper on a semi-cured polyimide resin substrates by the process of carboxylation of the resin surface, adsorption and reduction of copper ( II ) ions followed by thermocompression bonding. The potassium hydroxide treatment on polyimide resin lead to cleavage of imide ring to form the carboxyl group onto the resin surface, being responsible for the adsorption of copper ( II ) ions. The conductivity of the copper thin film formed by the reduction process was over 1.6×10^-2S/_??_ which was suitable for subsequent copper electroplating. The peel strength between polyimide film and copper film was reached to be 1.l0kN/m by thermocompression at 300°C under a pressure of 24.5MPa.

Journal

• Journal of The Japan Institute of Electronics Packaging

  Journal of The Japan Institute of Electronics Packaging 4 (7), 603-606, 2001

  The Japan Institute of Electronics Packaging

Keywords

• <I>Direct Metallization</I>
• <I>Polyimide Resin</I>
• <I>Surface Modification</I>
• <I>Copper Thin Film</I>
• <I>Thermocompression</I>

Details

• CRID: 1390282679538163584
• NII Article ID: 130004062882
• NII Article ID: 110001799832
• NII Book ID: AA11231565
• DOI: 10.5104/jiep.4.603
• ISSN: 1884121X
• ISSN: 13439677
• ISSN: http://id.crossref.org/issn/13439677
• NDL BIB ID: 5963541
• Web Site: http://id.ndl.go.jp/bib/5963541
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I5963541
• Web Site: http://www.jstage.jst.go.jp/article/jiep1998/4/7/4_7_603/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed