Micro Thermocouple Array for Measuring Resin Temperature in an Injection Mold

• TSUCHIYA Kensuke

  東京大学大学院工学系研究科

• NAKAO Masayuki

  東京大学大学院工学系研究科

Bibliographic Information

Other Title

• 射出金型内部の樹脂温度直接測定のためのマイクロ熱電対アレイの開発
• シャシュツ カナガタ ナイブ ノ ジュシ オンド チョクセツ ソクテイ ノ タメ ノ マイクロ ネツデンツイ アレイ ノ カイハツ

Abstract

This paper introduces a micro thermocouple array to measure resin temperatures and heat flux through resin in an injection mold. φ25μm alumel and chromel wires were welded by laser and assembled to integrate a micro thermocouple array with three measurement points on 0.5mm pitch. The micro thermocouple array was set inside the cavity of the injection mold, and the resin temperature was directly measured. The measurement result showed the resin temperature was 10 °C higher than the nozzle temperature while the resin passed the gate. Then the heat fluxes between each measurement points were calculated from resin temperatures measured at the three measurement points, and it was found that the maximum heat flux was about 2.3W/cm².

Journal

• Journal of the Japan Society for Precision Engineering, Contributed Papers

  Journal of the Japan Society for Precision Engineering, Contributed Papers 71 (10), 1255-1259, 2005

  The Japan Society for Precision Engineering

Keywords

• injection molding
• micro thermocouple array
• resin temperature

Details

• CRID: 1390001205282000256
• NII Article ID: 110001868407
• NII Book ID: AA11966630
• DOI: 10.2493/jspe.71.1255
• ISSN: 18818722
• ISSN: 13488716
• ISSN: 13488724
• NDL BIB ID: 7686664
• Web Site: http://id.ndl.go.jp/bib/7686664
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I7686664
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed