メタルボンド砥石によるSi<sub>3</sub>N<sub>4</sub>セラミックスの研削加工特性

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タイトル別名
  • Grindability of Silicon Nitride Ceramics with Metal-Bonded Grinding Wheel
  • メタル ボンド トイシ ニヨル Si3N4 セラミックス ノ ケンサク カコウ

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抄録

The effect of distribution of grain cutting edge on the surface of the wheel on the grindability of silicon nitride ceramics was evaluated with specific grinding energy and strength degradation. The main results are summarized as below. (1) The wheel with homogeneously controlled distribution of grain cutting edge showed lower specific grinding energy, and demonstrated higher fracture strength of the ground workpiece at the same value of stock removal rate. (2) The wheel with homogeneously controlled distribution of grain cutting edge demonstrated small strength degradation and distribution of fracture strength of the ground work-piece through decrease in the mean value of maximum grain depth of cut.

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