書誌事項
- タイトル別名
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- Deposition of Silicon Oxide Films with High Quality of Step Coverage by Nonequilibrium Plasma Chemical Reactions Using Pulsed Silent Discharge.
- ホウケイハ パルス ムセイ ホウデン オ モチイタ ヒヘイコウ プラズマ カガク ハンノウ ニ ヨル コウダンサ ヒフクセイ シリコン サンカ マク ノ ケイセイ
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抄録
Oxygen atoms play a very important role in atmospheric pressure chemical vapor deposition (CVD) processes for silicon oxide films using tetraethylorthosilicate (TEOS) and ozone. Efficient generation of active oxygen species including these oxygen atoms is realized by use of a square-pulsed silent discharge with very sharp rising and falling of applied voltage. In this study, nonequilibrium plasma chemical reactions by this discharge have been applied to a remote plasma CVD of silicon oxide films using TEOS and oxygen. And deposition characteristics of silicon oxide films by this method have been measured experimentally, and these have been compared with CVD characteristics using low frequency AC silent discharge. Futhermore, these have been compared with deposition characteristics of silicon oxide films using TEOS and ozone. As a result, it has been clarified that silicon oxide films with high quality of step coverage and high deposition rate of these films can be obtained by the remote plasma CVD using pulsed silent discharge.
収録刊行物
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- 日本機械学会論文集B編
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日本機械学会論文集B編 65 (639), 3814-3820, 1999
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390282680871386368
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- NII論文ID
- 110002395706
- 130004223692
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- NII書誌ID
- AN00187441
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- ISSN
- 18848346
- 03875016
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- NDL書誌ID
- 4921842
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
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- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可