CRACK GROWTH IN FUNCTIONALLY GRADED MATERIAL UNDER THERMAL SHOCK

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  • 320 熱負荷を受ける傾斜機能平板のき裂進展挙動に関する研究

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Abstract

This paper examines the problem of thermal cracking under a transient temperature field in a ceramic/metal functionally graded plate. When the functionally graded plate is cooled from high temperature, it could be observed that curved or stright multiple cracks occur on the ceramic surface. In addition, those multiple cracks influence each other and form complex arrays. To investigate mutual effect among multiple cracks, crack paths are simulated using finite element method. Transient thermal stress field and crack growth are treated as a linear quasi-static thermoelastic problem for a plane strain state.

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