Study on Influence of the Design Factors on the Reliability of BGA Solder Joints

• YU Qiang

  Yokohama National University

• JIN Jae Chul

  Yokohama National University

• ABE Hirokazu

  Yokohama National University

• SHIRATORI Masaki

  Yokohama National University

Bibliographic Information

Other Title

• 755 BGA はんだ接合部の信頼性における設計因子の影響度評価

Journal

• The Proceedings of The Computational Mechanics Conference

  The Proceedings of The Computational Mechanics Conference 2003.16 (0), 701-702, 2003

  The Japan Society of Mechanical Engineers

Keywords

• BGA Package
• Reliability Assessment
• Solder Joints
• Sensitivity Analysis

Details

• CRID: 1390001205853849472
• NII Article ID: 110002489081
• DOI: 10.1299/jsmecmd.2003.16.701
• ISSN: 24242799
• Web Site: https://www.jstage.jst.go.jp/article/jsmecmd/2003.16/0/2003.16_701/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles