ティッシュコンディショナーの粘弾性的性質におよぼすポリマー分子量の影響  [in Japanese] The Effect of the Molecular Weight of Polymer on Viscoelastic Properties of Tissue Conditioners  [in Japanese]

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Author(s)

    • 林 豊 HAYASHI Yutaka
    • 東北大学歯学部歯科理工学講座 Department of Dental Materials Science, Tohoku University School of Dentistry

Abstract

分子量の異なるポリメタクリル酸エチルを, 懸濁重合法により合成した. これらの粉末ポリマーと, ブチルフタリルグリコール酸ブチルのアルコール溶液を用い, ティッシュコンディショナーの貯蔵弾性率G′, 動的粘性η′, 損失正接tan δの周波数 (0.05〜70 Hz) および温度依存性を求めた. 各材料の種々の温度におけるG′, η′, tanδと周波数との関係に, 時間-温度換算則を適用することによって, それぞれ一本のマスターカーブが得られた. 材料の粘弾性的性質におよぼすポリマー分子量の影響が, 特に低周波数側で顕著に現われ, 分子量が小さくなると, 貯蔵弾性率は小さくなり, 損失正接は大きくなった. ティッシュコンディショナーの粉末に, ポリメタクリル酸エチルを用いる場合には, その分子量を幾分か小さく調節して, 口腔粘膜の変形の回復に応じて, 材料自体も流れをおこして変形するようにすべきである.

Poly (ethyl methacrylates) of different molecular weights were synthesized by suspension polymerization. These polymer powders, and a liquid that contained butyl phthalyl butyl glycolate and ethyl alcohol were used. The storage modulus G′, dynamic viscosity η′ and loss tangent tanδ of a mixture of powder and liquid were determined over the frequency range of 0.05 to 70 Hz at different temperatures. By the application of the time-temperature superposition principle, the curves of G′, η′ and tanδ versus frequencies at different temperatures for each material were superimposed to a single master curve. The remarkable effects of molecular weight of polymer on the viscoelastic properties of the materials found at the low frequency region; the lower the molecular weight, the lower the storage modulus G′ and the higher the loss tangent tanδ. These results suggest that in the use of poly (ethyl methacrylate) as the powder of tissue conditioner, the polymer should be adjusted to a lower molecular weight so that the material flows and deforms according to the recovery of the deformation of tissue.

Journal

  • The Journal of the Japanese Society for Dental Materials and Devices

    The Journal of the Japanese Society for Dental Materials and Devices 7(3), 439-443, 1988

    The Japanese Society for Dental Materials and Devices

Cited by:  5

Codes

  • NII Article ID (NAID)
    110002997766
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    0286-5858
  • Data Source
    CJPref  NII-ELS  J-STAGE 
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