Hybrid Defect Detection Method Based on the Shape Measurement and Feature Extraction for Complex Patterns

• KOBAYASHI Hilario Haruomi

  Production Engineering Ressearch Laboratory, Hitachi Ltd.

• HARA Yasuhiko

  Faculty of Engineering, Japan University

• DOI Hideaki

  Strategy Center of Research & Development Group, Hitachi Ltd.

• TAKAI Kazuo

  Telecommunication Systems Division, Hitachi Ltd.

• SUMIYA Akiyoshi

  Telecommunication Systems Division, Hitachi Ltd.

抄録

The visual inspection of printed circuit boards(PCBs) at the final production stage is necessary for quality assurance and the requirements for an automated inspection system are very high. However, consistent inspection of patterns on these PCBs is very difficult due to pattern complexity. Most of the previously developed techniques are not sensitive enough to detect defects in complex patterns. To solve this problem, we propose a new optical system that discriminates pattern types existing on a PCB, such as copper, solder resist and silk-screen printing. We have also developed a hybrid defect detection technique to inspect discriminated patterns. This technique is based on shape measurement and features extraction methods. We used the proposed techniques in an actual automated inspection system, realizing real time transactions with a combination of hardware equipped with image processing LSIs and PC software. Evaluation with this inspection system ensures a 100% defect detection rate and a fairly low false alarm rate(0.06%). The present paper describes the inspection algorithm and briefly explains the automated inspection system.

収録刊行物

• IEICE transactions on information and systems

  IEICE transactions on information and systems 83 (7), 1338-1345, 2000-07-25

  一般社団法人電子情報通信学会

キーワード

• printed circuit board
• image processing
• shape measurement
• feature extraction
• automatic inspection

詳細情報

• CRID: 1571135652464055680
• NII論文ID: 110003210320
• NII書誌ID: AA10826272
• ISSN: 09168532
• 本文言語コード: en
• データソース種別:
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