Hillock-Free Aluminum-Based Alloy Interconnections for Active-Matrix Liquid-Crystal Displays

• KATO Kinya

  NTT Integrated Information & Energy Systems Laboratories

• WADA Tsutomu

  Taikisha Co., Ltd.

• KAKUDA Nobuhiko

  NTT Advance Technology Co.

• KAWADA Tadamichi

  Applied Komatsu Technology, Inc.

抄録

A method is proposed for forming hillock-free aluminum-based alloy bus lines for active-matrix liquid-crystal displays (LCDs). Aluminum (Al)-based alloy films are deposited using an Al target containing boron (B) or nickel (Ni) in a sputtering ambient containing nitrogen. The Al-Ni films deposited using an Al target containing Ni showed excellent hillock resistance: virtually no hillock formation after thermal treatment at around 400℃ and no significant increase in resistivity. These films also showed good patternability with a simple wet etching: a smooth line edge and a gently tapered profile. These films are thus suitable for the bus lines of active matrices.

収録刊行物

• IEICE transactions on electronics

  IEICE transactions on electronics 80 (2), 320-326, 1997-02-25

  一般社団法人電子情報通信学会

キーワード

• aluminum-based alloy film
• liquid crystal display
• active-matrix

詳細情報

• CRID: 1570854177487978496
• NII論文ID: 110003211205
• NII書誌ID: AA10826283
• ISSN: 09168524
• 本文言語コード: en
• データソース種別:
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