A Simulation Method for EM Radiation from Power/Ground Plane of PCB by Using a Power Current Model, Vol.J86-B,No.2, pp.226-235

• TAKAYAMA Keisuke

  Faculty of Engineering,Okayama University

• KINOSHITA Tomohiro

  Faculty of Engineering,Okayama University

• MATSUISHI Takuya

  Faculty of Engineering,Okayama University

• MATSUNAGA Shigeki

  Faculty of Engineering,Okayama University

• WANG Zhi Liang

  Faculty of Engineering,Okayama University

• TOYOTA Yoshitaka

  Faculty of Engineering,Okayama University

• WADA Osami

  Faculty of Engineering,Okayama University

• KOGA Ryuji

  Faculty of Engineering,Okayama University

• FUKUMOTO Yukihiro

  Matsushita Electric Industrial Co.,Ltd.

• SHIBATA Osamu

  Matsushita Electric Industrial Co.,Ltd.

抄録

High-frequency currents flowing from power terminals of an IC/LSI onto power/ground planes of a digital printed circuit board can generate a great amount of electromagnetic noise. A powercurrent model of an IC/LSI for EMI simulation was proposed in our previous studies. A high-speed simulation algorithm of EM radiation due to resonance of the power/ground planes in a PCB was also developed. This paper describes the mechanism and quantitative effect of reducing high frequency currents on power/ground terminals by embedding a decoupling inductor and/or a bypass capacitor in an IC/LSI package. Furthermore, the internal decoupling effect on suppressing EMI radiated from the board is verified in both the simulations and measurements.

収録刊行物

• IEICE transactions on communications

  IEICE transactions on communications 86 (2), 887-, 2003-02-01

  一般社団法人電子情報通信学会

キーワード

• EMI
• simulation
• LSI
• power current model
• power decoupling
• PCB

詳細情報

• CRID: 1571135652316974848
• NII論文ID: 110003221677
• NII書誌ID: AA10826261
• ISSN: 09168516
• 本文言語コード: en
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