軟ろう付用フラックスの作用機構に関する研究-1-ステアリン酸の作用  [in Japanese] The Study on Flux Action of Soldering (Report 1) : On Stearic acid  [in Japanese]

Search this Article

Author(s)

Abstract

The flux action of soldering has hardly been investigated in relation to chemical reaction. This research was carried out to clarify the relation between flux action of organic acid (stearic acid) and spreading phenomenon of solder; and the reactions between stearic acid and base metal (Cu) or between the flux and solder (Sn-Pb eutectic solder) were studied. The results obtained are summarized as follows : 1) The sperad obtained on oxidized copper using stearic acid flux is greater than on electropolished specimens. 2) Stearic acid reacts with copper oxide on heating to give copper stearate, as well as clean the surface of copper plate. 3) With stearic acid flux containing a littel of copper stearate, the area of spread increases very markedly. 4) Copper stearate reacts with melted solder to give stearic acid and copper metal. From these results, the flux action of stearic acid may be considered as follows : Stearic acid reacts with copper oxide to give copper stearate, which reacts with solder and a Cu-rich layer in outer surface of solder is formed. So, the spreading of solder on copper plate becomes better.

Journal

  • Journal of the Japan Welding Society

    Journal of the Japan Welding Society 41(11), 1300-1305, 1972-11

    Japan Welding Society

Cited by:  1

Codes

  • NII Article ID (NAID)
    110003391873
  • NII NACSIS-CAT ID (NCID)
    AN00246019
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    00214787
  • NDL Article ID
    7652788
  • NDL Source Classification
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No.
    Z17-374
  • Data Source
    CJPref  NDL  NII-ELS 
Page Top