Preparation of Cubic Boron Nitride Films by RF Sputtering

  • Mieno Masahiro
    Department of Metallurgy and Materials Science, Faculty of Engineering, University of Tokyo
  • Yoshida Toyonobu
    Department of Metallurgy and Materials Science, Faculty of Engineering, University of Tokyo

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Cubic boron nitride (c-BN) films have been prepared by sputtering of a hexagonal BN sintered target under a negative self-bias voltage applied to Si substrates and a sputtering gas composition of Ar/N2. A c-BN phase was found to be contained only in the films prepared in pure Ar discharge with a negative self-bias above a threshold value. Moreover, the ratio of c-BN to hexagonal boron nitride increased with increasing negative self-bias voltage. The films consisting mainly of the c-BN phase were easily peeled from Si substrates on exposure to air because of their strong compressive stress.

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詳細情報 詳細情報について

  • CRID
    1573668927103697792
  • NII論文ID
    110003923532
  • NII書誌ID
    AA10457675
  • 本文言語コード
    en
  • データソース種別
    • CiNii Articles

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