A Planar Pump Using Electro-Conjugate Fluids (ECF),for Liquid Cooling of Electronic Chips

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  • 電界共役流体(ECF)を応用した電子チップ液冷用平面形ポンプ(J22-3 センサ・アクチュエータシステムとその知能化(3),J22 センサ・アクチュエータシステムとその知能化-実環境で活躍するメカトロニクスを目指して)

Abstract

This paper presents a liquid cooling concept for heat rejection of high power electronic chips existing in notebook computers etc. In order to realize, a liquid cooling system for the electronic chips such as notebook CPUs, a planar pump using the electro-conjugate fluid (ECF) is proposed and developed as a power source of the liquid cooling system. The ECF is a kind of dielectric and functional fluids, which generates jet flows (ECF-jets) by applying static electric field through a pair of rod-like electrodes. The ECF-jet directly interacts on the working fluid, so the proposed planar ECF pump needs no moving part, produces no vibration and noise. The ECF-jet intensity depends on the applied electric field, and electric field strength is related to the electrode dimensions. In the present investigation, we compared the pumping performance of various electrode dimensions and flow channel heights in order to establish the electrode design rules for improving the pumping performance of the planar ECF pump.

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