実験計画法を用いたボンディングワイヤループ形状適正化の検討(J01-4 最適構造設計,J01 エレクトロニクス実装における熱制御および信頼性評価)  [in Japanese] Optimization of Loop-shape of a Bonding Wire using Design of Experiments  [in Japanese]

Access this Article

Author(s)

Abstract

A method for evaluating fatigue life of the bonding wires in semiconductor packages under a temperature cycling test was studied analytically using a finite element method based on design of experiments. The sensitivity analysis of the maximum strain occurs in a bonding wire was carried out to make clear the effect of the loop-shape of the wire on the strain. It was found that we can evaluate the fatigue life of a bonding wire under various conditions of a temperature cycling test at the early stage of design by using both the Chebyshev function of a loop, shape factor and the Manson-Coffin fatigue life curve. It was also found that highly reliable loop shape of the wire can be designed by minimizing the strain using design of experiments.

Journal

  • The proceedings of the JSME annual meeting

    The proceedings of the JSME annual meeting 2004.6(0), 49-50, 2004

    The Japan Society of Mechanical Engineers

Codes

Page Top