はんだの変形にともなう起電力発生とその評価  [in Japanese] Generation of Electromotive Force of Solder Wires and Solder Joints Caused by Their Deformation and Its Evaluation  [in Japanese]

Search this Article

Author(s)

Abstract

Deformation of solder under uniaxial tensile and shear loads was studied using an electromotive force (EMF) method. The EMF started to increase as the solder wires deformed plastically and reached its maximum when necking and tensile fracture of the wires were observed. The maximum value of EMF increased linearly as the deformation speed increased. EMF generation was measured for the shear deformation of both solder wires and ball joints. The EMF maximum values for shear racture of solder joints varied according to the fracture surface conditions. These results demonstrate that the EMF method is a useful technique for evaluating the deformation of solder.

Journal

  • Journal of Japan Institute of Electronics Packaging

    Journal of Japan Institute of Electronics Packaging 9(6), 479-484, 2006-09-01

    Japan Institute of Electronics Packaging

References:  21

Cited by:  1

Codes

  • NII Article ID (NAID)
    110004781809
  • NII NACSIS-CAT ID (NCID)
    AA11231565
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    13439677
  • NDL Article ID
    8085846
  • NDL Source Classification
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL Call No.
    Z74-B258
  • Data Source
    CJP  CJPref  NDL  NII-ELS 
Page Top