傾斜型CTを用いた高密度実装基板解析  [in Japanese] The Analysis of the Substrate with High-Density Packaging Using the Oblique Computed Tomography  [in Japanese]

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Author(s)

Journal

  • Journal of Japan Institute of Electronics Packaging

    Journal of Japan Institute of Electronics Packaging 10(7), 528-532, 2007-10-23

    Japan Institute of Electronics Packaging

References:  13

Cited by:  1

Codes

  • NII Article ID (NAID)
    110006437324
  • NII NACSIS-CAT ID (NCID)
    AA11231565
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    13439677
  • NDL Article ID
    9262895
  • NDL Source Classification
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL Call No.
    Z74-B258
  • Data Source
    CJP  CJPref  NDL  NII-ELS 
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