Studies on Flux Action of Soldering (Report III) : Organic Metal Salts

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Author(s)

Abstract

In previous paper on flux action of aniline hydrochloride for soldering, it was shown that the reaction of CuCl_2 and Cu-complex with molten Sn-Pb alloy solder and the dissolution of Cu into the solder played an important role in spreading of solder on copper plate. In this paper, flux action of various metal salts for soldering has been studied from the view point of the reaction of the flux with molten Sn-Pb eutectic alloy solder and spreading of solder. The flux action of metal salt may be considered as follow ; Metal salt (metal benzoate and various metal stearates) reacts with molten Sn-Pb eutectic alloy solder to give metal and Sn salts. The metal dissolves immediately into the molten solder. The wetting of Sn-Pb solder on copper plate is improved by the reaction and the dissolution of the metal into molten solder. So, Sn-Pb alloy solder spreads well over copper plate. And, the reaction of metal salts with molten Sn-Pb eutectic alloy solder may depend on the oxidation and reduction potentials of metal and free energy (ΔF) for a formation of metal stearate.

Journal

  • Transactions of JWRI

    Transactions of JWRI 2(2), 226-231, 1973-10

    Osaka University

Codes

  • NII Article ID (NAID)
    110006484461
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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