Effect of Sn Addition to Cu-Ti Filler Metals on Microstructure and Strength of SiC/SiC Joint(Materials, Metallurgy & Weldability)

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Author(s)

Abstract

SiC was brazed to SiC in vacuum using two series of Cu-16.5 at%Sn-X at%Ti and Cu-X at%Sn-21 at%Ti alloys. At a constant Sn content of 16.5 at% the strength of the SiC/SiC joint shows a maximum at 5.6 at%Ti , and decreases with the further content of Ti in the alloys. Two factors operates to yield the maximum strength of the SiC/SiC joint. The fine Ti_5Si_3 precipitates distribute densely at the SiC/the alloy interface, and α-Cu solid solution containing Sn and δ-Cu-Sn intermetallic yield a two phase eutectoid structure. The excess amounts of Sn and Ti in the alloys form a brittle intermetallic of CuSn_3Ti_5 in the joining layer of SiC/SiC, and affect the strength of the joint.

Journal

  • Transactions of JWRI

    Transactions of JWRI 28(1), 35-40, 1999-07

    Osaka University

Codes

  • NII Article ID (NAID)
    110006486044
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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