Microjoining Process in Electronic Packaging and Its Numerical Analysis

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Author(s)

    • GANG Tie
    • JWRI, Osaka University, National Key Laboratory of Advanced Welding Production Technology

Abstract

The present study was carried out for the purpose of understanding interfacial deformation processes during solid state inner lead bonding, which is used in electronic packaging. At first, the representative microjoining processes are summarized by showing some photos and illustrations. After that, the interfacial deformation between the electric pad and the inner lead is analyzed, using numerical simulations. In particular, two effects of the bump thickness and the mechanical property on the interfacial extension are analyzed. The numerical simulations are carried out by using a finite element method (FEM), which can be applied for large deformation of rate sensitivity materials.

Journal

  • Transactions of JWRI

    Transactions of JWRI 30(1), 1-11, 2001-07

    Osaka University

Codes

  • NII Article ID (NAID)
    110006486096
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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