4-3 Solid-state Diffusion Bonding of Metals(Session 4 : New Joining Processes for Advanced Materials,SIMAP'88 Proceedings of International Symposium on Strategy of Innovation in Materials Processing-New Challenge for the 21st Century-)

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Author(s)

    • WALLACH E.R.
    • Department of Materials Science & Metallurgy, University of Cambridge

Abstract

Diffusion bonding is finding increased industrial applications in joining such diverse materials as superplastic metallic alloys, metal matrix composites and the new high critical temperature ceramic superconductors. In this paper, scientific aspects of the technique, rather than applications, are considered for the joining of metals ; modelling the process and bond assessment by mechanical testing non-destructive evaluation and microscopy are discussed.

Journal

  • Transactions of JWRI

    Transactions of JWRI 17(1), 135-148, 1988-05

    Osaka University

Codes

  • NII Article ID (NAID)
    110006486788
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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