D4-2 Soldering Microelectronic Assemblies : Some Problems and Studies(Discussions and Concluding Remarks,Session 4 : New Joining Processes for Advanced Materials,SIMAP'88 Proceedings of International Symposium on Strategy of Innovation in Materials Processing-New Challenge for the 21st Century-)

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Author(s)

Journal

  • Transactions of JWRI

    Transactions of JWRI 17(1), 149-150, 1988-05

    Osaka University

Codes

  • NII Article ID (NAID)
    110006486790
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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