P-3 Bonded Multi-layer Materials : The Materials of the Future(Poster Session,SIMAP'88 Proceedings of International Symposium on Strategy of Innovation in Materials Processing-New Challenge for the 21st Century-)

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Author(s)

Abstract

Multi-layer materials composed of various metallic or metallic-and-ceramic layers, and also from materials with modified surfaces may have various physico-chemical, electric and mechanical properties. This is why a great progress in the production of these materials is expected. To develop the optimum methods for bonding these materials, the following physico-chemical problems must be mastered, among other things: activation of sparingly wettable surfaces, draining of electric charge in bonding dielectric layers, reduction of the temperature of bonding or minimizing of the heat leakage zone in bonding magnetic layers, as well as the simultaneous sintering of different metallic and ceramic layers. The article deals with the anticipated methods of producing multi-layer materials and the expected progress in the sphere of the ir bonding techniques.

Journal

  • Transactions of JWRI

    Transactions of JWRI 17(1), 263-272, 1988-05

    Osaka University

Codes

  • NII Article ID (NAID)
    110006486807
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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