Spreading of Copper Phosphorus Brazing Filler Metals with Low Melting Temperature containing silver and/or Tin : Copper Phosphorus Brazing Filler Metals with Low Melting Temperature (Report IV)(Physics, Process, Instrument & Measurement)

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Author(s)

Abstract

Spreadability of copper phosphorus brazing filler metals with low melting temperature has been investigated on pure copper base metal. Spread tests were carried out between 650℃ and 715℃ in an air atmosphere without flux. Spread area of Cu-Sn-P filler metals were inferior to that of Cu-Ag-P filler metals, which is explained by the thermodynamic calculation that tin oxide is not so easily reduced by phosphorus compared with copper oxide. The spread area of Cu-Ag-Sn-P quaternary system filler metals were larger than Cu-Sn-P system at the same test temperature, however, the area was significantly smaller than in Cu-Ag-P ternary system. The fillet formation test in argon gas atmosphere revealed the good fillet was obtained in both Cu-Ag-P and tin bearing filler metals. Tin bearing filler metals showed better fillet appearance at lower brazing temperatures.

Journal

  • Transactions of JWRI

    Transactions of JWRI 18(2), 199-203, 1989-12

    Osaka University

Codes

  • NII Article ID (NAID)
    110006486862
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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