Erosion of Pure Copper by Copper Phosphorus Brazing Filler Metals containing Tin and Silver : Copper Phosphorus Brazing Filler Metals with Low Melting Temperature (Report V)(Physics, Process, Instrument & Measurement)

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Author(s)

Abstract

The erosion of pure copper base metal by molten brazing filler metal was investigated using copper phosphorus brazing filler metals with low melting temerature containing tin and silver. The depths of erosion were measured at central cross section of spread test specimens. The additional elements of silver, tin and phosphorus significantly increased the erosion depth with increasing their content. Erosion depth increaseed linearly with square root of the holding time at 700〜740℃. The activation energy of erosion of copper base metal by Cu-Sn-P filler metal coincided well with that of diffusion of tin in solid copper, suggesting the erosion reaction is controlled by diffusion of tin in solid copper. Phosphorus content has the greatest influence on the erosion depth of copper base metals among the filler metal elements.

Journal

  • Transactions of JWRI

    Transactions of JWRI 18(2), 205-209, 1989-12

    Osaka University

Codes

  • NII Article ID (NAID)
    110006486863
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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