Modelling of Solid State Bonding Process by Power Law Creep(Physics, Process, Instruments & Measurements)

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Author(s)

Abstract

The model of solid state bonding based on the finite element method is proposed. It is assumed that the bonding (adhering) process is controlled by viscoplastic (power law creep) deformation. This finite element method can be applied to the large deformation processes, in which the strain rate dependence is taken into account. The numerical results agrees with the experimental ones. We further discuss different models proposed by several researchers, comparing them with the finite element model with respect to the void shrinking rate. It is found that the applicability of the solid state bonding due to power law creep are limited by the degree of bulk deformation (value of strain rate), i.e., the void crushing rate is strikingly affected by the constraint condition of bulk. Therefore, we need to select the models in accordance with the situation of bulk deformation.

Journal

  • Transactions of JWRI

    Transactions of JWRI 20(2), 155-164, 1991-12

    Osaka University

Codes

  • NII Article ID (NAID)
    110006486947
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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