Algorithm for Determining Optimum Bonding Condition in Solid State Diffusion Bonding by a Numerical Model(Physics, Process, Instruments & Measurements)

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Author(s)

Abstract

An algorithm to estimate the optimum bonding time is developed by a numerical model, for the purpose of establishing the system of determining the optimum process conditions of the solid state diffusion bonding. The influence of the scattering of surface roughness on the bonding time required to complete the bonding process is mainly examined by the numerical model. The distribution of void spacing in the final stage (bond ratio>95%) is taken into consideration in order to establish the algorithm. It is shown that the plural trials of measuring surface profiles are beneficial to estimate the complete bonding time.

Journal

  • Transactions of JWRI

    Transactions of JWRI 21(1), 37-41, 1992-06

    Osaka University

Codes

  • NII Article ID (NAID)
    110006486973
  • NII NACSIS-CAT ID (NCID)
    AA00867058
  • Text Lang
    ENG
  • ISSN
    03874508
  • Data Source
    NII-ELS 
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