Removal of Resin-based Root Canal Filling Materials with K3 Rotary Instruments: Relative Efficacy for Different Combinations of Filling Materials

DOI NDLデジタルコレクション Web Site 被引用文献5件 参考文献42件
  • IIZUKA Naoyuki
    Division of Cariology, Operative Dentistry and Endodontics, Department of Oral Health Sciences, Niigata University Graduate School of Medical and Dental Sciences
  • TAKENAKA Shoji
    Division of Cariology, Operative Dentistry and Endodontics, Department of Oral Health Sciences, Niigata University Graduate School of Medical and Dental Sciences
  • SHIGETANI Yoshimi
    Division of Cariology, Operative Dentistry and Endodontics, Department of Oral Health Sciences, Niigata University Graduate School of Medical and Dental Sciences
  • OKIJI Takashi
    Division of Cariology, Operative Dentistry and Endodontics, Department of Oral Health Sciences, Niigata University Graduate School of Medical and Dental Sciences

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Removal of resin-based root canal filling materials may cause serious problems during root canal retreatment. This study compared the working time and amount of canal enlargement when different resin-based root canal filling materials were removed with K3 rotary instruments with or without heat-softening using System B. Root canal sealer/filling point combinations tested were Epiphany/Resilon, SuperBond/Resilon, SuperBond/gutta-percha, and Canals N/gutta-percha. The materials were filled into simulated curved resin canals and removed with K3 instruments in a standardized crown-down procedure. In terms of working time, Epiphany/Resilon required a significantly longer working time than the others. However, heat application with System B significantly reduced the working time for the removal of Epiphany/Resilon. In terms of canal enlargement, there were no significant differences among the tested groups as determined with digital morpho-metry. It was thus concluded that Epiphany removal with K3 rotary instruments might result in extended working time, but which could be reduced with heat-softening using System B.

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