X-ray Evaluation of Deformation Behaviour of Copper thin Films Under Uniaxial Loading

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  • 単軸負荷下における銅薄膜の変形挙動のＸ線的評価
  • タンジク フカカ ニ オケル ドウ ハクマク ノ ヘンケイ キョドウ ノ Xセンテキ ヒョウカ

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Abstract

Tensile tests were carried out for Cu sputtered thin films on polyimide film. Four kinds of thin films were fabricated by RF-magnetron sputtering. The target power was changed from 10 to 150 W to change the grain size. The grain size increased with increasing target power. The effect of grain size on the deformation behavior under tensile loading was investigated by X-ray method. The residual stress, the 0.2% proof stress and the hardness increased with increasing grain size. The stress-strain behavior can be divided into four regions. In the first region, the X-ray stress increased linearly with applied strain. In the second region, the full width at half maximum, FWHM, increased rapidly. Then the stress became constant in the third region. In the final region, the stress and FWHM decreased with applied strain. For the specimen with fine grains, the value of FWHM decreased with X-ray stress during unloading. When the stress became zero, the value of FWHM decreased to an initial value. After tensile loading, many intergranular cracks could be observed on the specimen surface.

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