Heat-cycle endurance and in-plane thermal expansion of Al2O3/Al substrates formed by aerosol deposition method
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- SAKAMAKI Ryo
- Graduate School of Science and Engineering, Tokyo Institute of Technology
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- HOSHINA Takuya
- Graduate School of Science and Engineering, Tokyo Institute of Technology
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- KAKEMOTO Hirofumi
- Graduate School of Science and Engineering, Tokyo Institute of Technology
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- YASUDA Kouichi
- Graduate School of Science and Engineering, Tokyo Institute of Technology
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- TAKEDA Hiroaki
- Graduate School of Science and Engineering, Tokyo Institute of Technology
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- AKEDO Jun
- National Institute of Advanced Industrial Science and Technology
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- TSURUMI Takaaki
- Graduate School of Science and Engineering, Tokyo Institute of Technology
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抄録
A new heat radiation substrate for high power modules has been proposed by utilizing Al2O3 thick films formed by the aerosol deposition method (ADM) on Al substrates. Dense Al2O3 thick films (AD-Al2O3) could be obtained by the ADM at room temperature. A heat-cycle endurance test between -80°C and 180°C revealed that the AD-Al2O3/Al substrates were superior to the conventional direct brazed aluminum (DBA) substrates using AlN ceramics bounded to Al substrates. No lamination was observed between the AD-Al2O3 films and Al substrates after heat-cycle test in spite of the difference of thermal expansion coefficient between Al2O3 and Al. The in-plane thermal expansion coefficient of AD-Al2O3 films was almost the same as that of Al substrates, indicating that plastic deformation was induced in the AD-Al2O3 films consisting of nano-sized grains to relax the stress caused by the difference of thermal expansion coefficient.
収録刊行物
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- Journal of the Ceramic Society of Japan
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Journal of the Ceramic Society of Japan 116 (1360), 1299-1303, 2008
公益社団法人 日本セラミックス協会
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詳細情報 詳細情報について
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- CRID
- 1390282680260722688
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- NII論文ID
- 110007007495
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- NII書誌ID
- AA12229489
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- ISSN
- 13486535
- 18820743
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- NDL書誌ID
- 9721988
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可