Heat-cycle endurance and in-plane thermal expansion of Al2O3/Al substrates formed by aerosol deposition method

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  • SAKAMAKI Ryo
    Graduate School of Science and Engineering, Tokyo Institute of Technology
  • HOSHINA Takuya
    Graduate School of Science and Engineering, Tokyo Institute of Technology
  • KAKEMOTO Hirofumi
    Graduate School of Science and Engineering, Tokyo Institute of Technology
  • YASUDA Kouichi
    Graduate School of Science and Engineering, Tokyo Institute of Technology
  • TAKEDA Hiroaki
    Graduate School of Science and Engineering, Tokyo Institute of Technology
  • AKEDO Jun
    National Institute of Advanced Industrial Science and Technology
  • TSURUMI Takaaki
    Graduate School of Science and Engineering, Tokyo Institute of Technology

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Abstract

A new heat radiation substrate for high power modules has been proposed by utilizing Al2O3 thick films formed by the aerosol deposition method (ADM) on Al substrates. Dense Al2O3 thick films (AD-Al2O3) could be obtained by the ADM at room temperature. A heat-cycle endurance test between -80°C and 180°C revealed that the AD-Al2O3/Al substrates were superior to the conventional direct brazed aluminum (DBA) substrates using AlN ceramics bounded to Al substrates. No lamination was observed between the AD-Al2O3 films and Al substrates after heat-cycle test in spite of the difference of thermal expansion coefficient between Al2O3 and Al. The in-plane thermal expansion coefficient of AD-Al2O3 films was almost the same as that of Al substrates, indicating that plastic deformation was induced in the AD-Al2O3 films consisting of nano-sized grains to relax the stress caused by the difference of thermal expansion coefficient.

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